The idea of using the layout properties of the system unit to organize silent cooling of components is not new; as heat pipes proliferated, manufacturers began to use side panels as radiators. A Taiwanese company recently suggested placing the processor heatsink behind the back of the motherboard.
The FanlessTech resource has traditionally written about this unusual development. It is known that ENCTEC is a young Taiwanese company that proposes to change the fundamental principle of motherboard layout by placing a processor socket on the back. In principle, for models of motherboards with a processor soldered directly to a printed circuit board, this option is not too critical, but to organize cooling, a special case of the system unit will be required.
It is something ENCTEC is going to offer, providing a special window in the side panel behind the motherboard plane, which opens access to an extensive processor heatsink. As conceived by the creators, in this place the radiator will gain access to colder air, although the absence of fans in the immediate vicinity imposes certain restrictions on the placement of the entire system unit.
When assembled, the radiator is covered with a small flap that does not adjoin the side panel of the system unit, leaving gaps for air access around the perimeter. Whether this development will get the right to a pipeline life is not yet specified, but the very approach to passive cooling of the processor deserves attention.
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