IT NewsFacts and forecastsTechnology
Natalia Solovieva | 10/15/2020
Intel has entered into an agreement with the U.S. Navy to participate in the State-of-the-Art Heterogeneous Integration Prototype (SHIP) project. Contract amount, in accordance
with which Intel will help the military develop prototypes of more advanced microcircuits for the needs of the army is unknown.
Heterogeneous integrated packaging allows you to create low cost, small and flexible system solutions by integrating multiple highly complex chips or components in a single package
(system in package, SiP) and thus combining the maximum number of functions. It is expected that in the course of the work, the physical dimensions of the electronic device will be reduced,
performance and reliability, and reduced power consumption.
According to open sources, US Navy engineers intend to develop a state-of-the-art SHIP prototype, demonstrating a new approach to safe, measurable, and cost-effective
effective design of such devices. The project will use innovative methods, including new design, manufacturing and testing tools. On the second
At the stage of the project, experts say, prototypes of multichip packages will be developed and work will be carried out on standards for interfaces and security protocols for heterogeneous systems.
It is also reported that all development and testing must comply with the International Arms Trade Regulations (ITAR).
As a result, the US Army intends to develop more advanced microelectronic devices for their needs. The contract is overseen by the Crane Division of the Combat Operations Center
surface forces of the US Navy.
Intel’s participation in the project implies its assistance in the development of prototype microcircuits for the US Navy, using advanced products – its own semiconductor packaging technology at factories in
Arizona and Oregon.
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