Intel has just recently released 11th generation Core desktop processors (Rocket Lake-S), and the notorious enthusiast Roman “der8auer” Hartung has already scalped the new flagship Core i9-11900K. Removing the cover and replacing the standard thermal interface brought interesting results.
To begin with, the enthusiast noted that removing the lid from Rocket Lake-S is more difficult than from their predecessors, the Comet Lake-S family. It’s all about the larger crystal of the novelties, and accordingly there is more solder between the crystal and the lid. Because of this, it was not possible to remove the lid with a simple shift, and I had to first heat the processor in the oven. Additionally, the process of removing the cover was slightly complicated by the presence of capacitors on the front side of the substrate. Therefore, when scalping, you need to be as careful as possible.
After removing the cap, the enthusiast replaced the stock Intel indium-based solder with a Thermal Grizzly Kryonaut liquid metal thermal interface. Usually such manipulations do not bring a significant decrease in temperature, on average, a maximum of 3-5 ° C, since the stock Intel solder copes with its tasks quite well. However, in the case of Rocket Lake-S, things turned out to be very different.
Replacing the solder with “liquid metal” reduced the average temperature of processor cores under load by more than 10 degrees – from just over 90 ° C to less than 80 ° C. And for individual nuclei, the temperature amplitude turned out to be even more impressive. We add that the processor was tested in Prime 95 without AVX, overclocked to 5.0 GHz on all cores with a voltage of 1.38 V.
CPU power consumption has dropped along with the temperature. With the standard solder, it was 297 W under load, and after replacing it with “liquid metal” it became 289 W. Not the most significant difference, and the consumption is still huge for a desktop processor.
What are the reasons for such a large temperature difference? Most likely, due to the large area of the crystal, it is impossible to apply the solder evenly and with high quality, as a result, not the best contact between the processor cover and the crystal is provided, which leads to a high temperature.
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