Intel has paid enough attention to optimizing the layout of the Comet Lake-S ten-core processors to improve heat dissipation. The enthusiasts clearly did not satisfy these measures, so they would not mind replacing the standard thermal interface under the cover of the Core i9-10900K with “liquid metal”. Such a transformation allows you to win up to eight degrees under load.
Like any operation to remove the cover from the processor, replacing the standard thermal interface will invalidate the warranty. German enthusiast Roman Hartung, known to regular readers under the pseudonym Der8auer, conducted experiments with the Core i9-10900K using a liquid cooling system. First, he launched Cinebench on a processor that was not modified. The temperature for all ten cores was monitored using the HWiNFO64 utility.
Next, the Delid Die Mate 2 device was used, which allowed removing the lid from the Intel Core i9-10900K processor only due to mechanical impact. According to the author of the experiment, the thickness of the standard thermal interface, which Intel calls “solder”, reaches 0.3 mm. Der8auer removed his remains from the processor chip and lid with a razor blade. The sealant around the perimeter of the processor circuit board was removed in a similar way.
By applying a Thermal Grizzly liquid metal type thermal interface to the processor chip, the author of the experiment put the heat-distributor cover in place. According to his estimates, the gap between the lid and the crystal was significantly reduced, presumably to 0.05 mm. If we compare the Core i9-9900K and Core i9-10900K, then the first one has a higher crystal (0.88 vs 0.58 mm), but the heat-distributor cover is heavier (22.2 vs 20.2 g) and thicker (2.59 vs 2 , 35 mm) in the second.
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